Premium Intel was the first large chipmaker to start using advanced packaging methods in 2017 – 2019. But where are Intel's EMIB and Foveros technologies today and where are they heading?
Elon Musk may prefer FEL light sources for in-house chip production, but Terafab will start with proven tech from ASML.
GlobalFoundries returns to advanced FD-SOI development with 7nm-class FDX Fusion process — production planned for 2028.
GloFo becomes TSMC subcontractor.
Wolfspeed will use long term-financing to upgrade its GaN epitaxy capabilities and to develop radiation hardening capabilities
AMD is pursuing a 'broader partnership' with Samsung as memory company wants to tie advanced memory supply to its orders at its foundry unit.
Premium Two former Groq engineers sued Groq’s board in Delaware over the Nvidia licensing deal behind the Groq 3 LPU.
Lip-Bu Tan says Intel will remain a part of Elon Musk's Terafab project as Musk wants TSMC to sublease a part of the facility.
Premium Qualcomm will license patents behind Huawei’s LogicFolding, according to one report, as a teardown shows off the Kirin 9050 Pro’s two dies.
Huawei and Qualcomm sign a multi-year patent cross-license covering 5G and AI, with Qualcomm buying some Huawei US patents.
Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.