A state-backed company in Shanghai has begun mass-producing immersion deep ultraviolet lithography machines and is due to deliver the first units this year.
Premium TYLsemi is set to offer pre-validated chiplets, along with custom ASIC design services, and build highly custom multi-tile processors at relatively low costs.
Premium Intel will design, package, and fabricate Fortinet's sixth-generation Security Processor (SP6) on its Intel 4 node.
SP6 will draw on what the companies described as Intel's expertise in disaggregated semiconductor design and advanced packaging.
TSMC reportedly intends to increase prices of wafers it processes citing demand, rising costs, and increased investments in new capacity.
SMIC's N+3 process technology can achieve transistor density comparable to TSMC's N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.
Premium Low-NA, high stakes
TSMC's A14 process technology progresses faster than N2 at this stage of development as developers of both client and AI/HPC plan to use it.
ASML's comments point to intentions to increase prices, though the company is expected to maintain its value-based approach to price setting. Yet, TSMC is reportedly unhappy about the potential plan.
Premium Tower Semiconductor has announced a dual-track expansion of its 300mm silicon photonics, silicon germanium, and advanced packaging operations in Japan
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